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PCB Capability
| Article | Description | Capability | 
| Material | Laminate materials | FR4, High TG FR4, High Frequency, Alum, FPC... | 
| Board Cutting | Number of layers | 1-48 | 
| Min.thickness for inner layers (Cu thickness are excluded)  |  			0.003”(0.07mm) | |
| Board Thickness | Standard | (0.1-4mm±10%) | 
| Min. | Single/Double:0.008±0.004” | |
| 4layer:0.01±0.008” | ||
| 8layer:0.01±0.008” | ||
| Bow and twist | no more than 7/1000 | |
| Copper Weight | Outer Cu weight | 0.5-4 0z | 
| Inner Cu weight | 0.5-3 0z | |
| Drilling | Min size | 0.0078”(0.2mm) | 
| Drill deviation | ±0.002″(0.05mm) | |
| PTH hole tolerance | ±0.002″(0.005mm) | |
| NPTH hole tolerance | ±0.002″(0.005mm) | |
| Solder Mask | Color | Green,white,black,red,blue… | 
| Min solder mask clearanace | 0.003″(0.07mm) | |
| Thickness | (0.012*0.017mm) | |
| Silkscreen | Color | white,black,yellow,blue… | 
| Min size | 0.006″(0.15mm) | |
| Max Size of Finish Board | 700*460mm | |
| Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… | |
| PCB Outline | Square,circle,irregular(with jigs) | |
| Package | QFN,BGA,SSOP,PLCC,LGA | |

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