1. Detailed Specification of PCB Board Manufacturing
| 1 | Layer | 1-48 layer |
| 2 | Material | FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum |
| 3 | Board thickness | 0.4mm-4mm |
| 4 | Max.finished board side | 700mm*460mm |
| 5 | Min.drilled hole size | 0.25mm |
| 6 | Min.line width | 0.10mm(4mil) |
| 7 | Min.line spaceing | 0.10mm(4mil) |
| 8 | Surface finish/treatment | HASL/HASL lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating |
| 9 | Copper thickness | 1/2OZ 1OZ 2OZ 3OZ |
| 10 | Solder mask color | green/black/white/red/blue/yellow |
| 11 | Inner packing | Vacuum packing,Plastic bag |
| 12 | Outer packing | Standard carton packing |
| 13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| 14 | Certificate | IATF16949, ISO13485, ISO9001 |
| 15 | Profiling Punching | Routing,V-CUT,Beveling |
| 16 | Assembly Service | Providing OEM service to all sorts of printed circuit board assembly |
2.Detailed Terms for PCB Assembly
| Technical Requirement | Professional Surface-mounting and Through-hole soldering Technology |
| Various sizes like 1206,0805,0603 components SMT technology |
| ICT(In Circuit Test),FCT(Functional Circuit Test) technology |
| PCB Assembly With UL,CE,FCC,Rohs Approval |
| Nitrogen gas reflow soldering technology for SMT |
| High Standard SMT&Solder Assembly Line |
| High density interconnected board placement technology capacity |
| Quote&Production Requirement | Gerber File or PCB File for Bare PCB Board Fabrication |
| Bom(Bill of Material) for Assembly,PNP(Pick and Place file) and Components Position also needed in assembly |
| To reduce the quote time, please provide us the full part number for each components,Quantity per board also the quantity for orders. |
| Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate |
| OEM/SMT/EMS Services | PCBA, PCB assembly: SMT & PTH & BGA |
| PCBA and enclosure design |
| Components sourcing and purchasing |
| Quick prototyping |
| Plastic injection molding |
| Metal sheet stamping |
| Final assembly |
| Test: AOI, In-Circuit Test (ICT), Functional Test (FCT) |
| Custom clearance for material importing and product exporting |
| Other PCB Assembly Equipments | SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4 |
| Reflow Oven: FolunGwin FL-RX860 |
| Wave Soldering Machine: FolunGwin ADS300 |
| Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service |
| Fully Automatic SMT Stencil Printer: FolunGwin Win-5 |
FASTPCBA is the top 10 manufacturing and pcb assembly factory globally, with ISO 14000, 13485, ISO9001, and IATF16949 certificates simultaneously, can provide better pcba service for customers from Iot pcba aerospace pcba, military pcba, communication pcba, industrial pcba, medical pcba, automotive pcba etc.
FASTPCBA keeps pace with the times, has imported advanced X-RAY, 3D AOI, selective wave soldering, MADATA, YAMAHA etc equiments, we can provide original package componets agent service, custom pcb manufacturing, precise pcb assembly, accurate pcb printing, save your cost and time at the same time.
FASTPCBA survival more than 20 years, as our goal is always provide best quality pcba solution for customers from domestic and abroad like Russia, Brazil, Japan, America, Gemany, France, UK etc. FASTPCBA can turn your pcb design to pcba or pcb assp, welcome to inquiry and visit us in shenzhen china.
Technical Requirement for pcb assembly:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Production Requirement for pcb assembly:
1.Gerber Files (Eagle and PCB File are available).
2.BOM list.
3.Clear pictures of PCBA or PCBA samples to us.
4.Pick N Place file.
5.Test procedure for PCBA.
